ET.AL, Y. A. . CMOS RF Integrated Circuit Reliability Studies For Ultra-Thin Flexible Packaging. Turkish Journal of Computer and Mathematics Education (TURCOMAT), [S. l.], v. 12, n. 13, p. 4893–4398, 2021. DOI: 10.17762/turcomat.v12i13.9568. Disponível em: https://www.turcomat.org/index.php/turkbilmat/article/view/9568. Acesso em: 22 jul. 2024.